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Chunya Wu
Education
2021.09 - 24.06
University of Hawaii at Manoa
D.Arch 丨 Global Track
Honolulu, HI
GPA 3.97
2021.09 - 24.06
Tongji University
M.Arch
Shanghai, China
GPA 3.93
2016.09 - 21.06
Southeast University
B.Arch
Nanjing, China
GPA 3.87
2019.08 - 20.01
KTH Royal Institute of Technology
Semester Exchange
Stockholm, Sweden
Certification
NCARB Candidate
Record Number: 887147
LEED AP BD+C credential
GBCI#: 0011506147
WELL AP Credential
IWBI#: WELL-AP-0000147731
Experience
Skills
3D Modeling
Rendering
Graphic design
Programming
Revit
Sketchup
Rhino
Grasshopper
Enscape
V-Ray
Lumion
Adobe Suite
Microsoft Series
AutoCAD
Affinity Series
Python
SPSS
Tableau
Matlab
Awards & Honors
Design Awards
Honors & Scholarships
2023.09
Seoul Biennale of Architecture and Urbanism 2023
Invited exhibition participant
2023.08
2023 ACSA Steel Competition
Third Place
2021.06
Asian Design Yearly Award
Bronze
2019
Architectural Rookie designers competition
6/1587
2018
Student Structure Design Competition of Jiangsu Province
Grand prize
2023.12
UHM ISS Spring Scholarship
2022.09
Tongji University Outstanding Social Activist Scholarship
2021.09
Sunshine Education Scholarship of Tongji University
2020.03
SEU Yearly Merit Student
2019.10
China National Scholarship
2018.10
Suzhou Excellent Young Professional Scholarship
2017.09
Cheng Tai-ning Excellent Architectural Design Scholarship
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